The cooling piece of high-power general models, Entering by a misunderstanding, that the power the greater the cooling, the it is not true Key depends on what your use, if you do not understand or did not used - not to purchase If it is fun, and we do not recommend high-power, Of course, each cooling piece has its own dedicated purposes, specifically to consult our technical staff Current cooling-chip power, large power consumption, heat is also high, if not cooling effect of cooling to meet a serious decline, not even small power, if not for your device-specific, we do not recommend the purchase of Generally high power for heating and cooling tank, the heating requirements are not too hot, cooling requirements are not too cold occasion of its biggest advantages is the fast response Cooling is generally recommended water cooling, air cooling is difficult to meet unless the do not ask!
Chip Model: TES1-12702
Dimensions: 30 * 30 * 4.0mm element number 127 Wire specifications: wire lead length of 150± 5mm of RV standard single head 5mm tinned Internal Resistance: 6~ 6.2Ω (ambient temperature 23 ± 1 ° C, 1kHZ of Ac test) The maximum temperature difference: Tmax (Qc = 0) 65 °C above. Operating current: Imax = 2A (the start of the rated voltage) Rated voltage: DC12V (Vmax: 12V) Cooling power: Qcmax 24W Assembly pressure: 85N/cm2 Working environment: temperature range -55 °C to 83 °C (too high ambient temperature will directly affect the cooling efficiency) Packaging technology: around the standard 704 silicone rubber seal Packaging standards: foam boxes for packaging, storage conditions of ambient temperature -10 °C to 40 °C Storage conditions: -40 to 60 ° C
The refrigeration tablets principle introduced
The thermoelectric cooling thermoelectric effect is the application of the Peltier effect refrigeration technology. Practical thermoelectric cooling device is a thermoelectric effect was significantly more efficient thermoelectric cooling semiconductor thermocouple constituted.
Semiconductor thermocouple by the N-type semiconductor and P-type semiconductor. N-type materials have a surplus of electrons, and negative thermoelectric power. P-type materials, electronic, positive thermoelectric power; when electrons from the P-type through the node to the N-type, its energy must increase, and increase the energy equivalent of junction point of the energy consumed. This can be the difference in temperature reduce to prove.
The top of the thermopile cold junction, the following is the hot end. With the heat exchangers and other heat transfer means, so that the thermopile
On the contrary, when the electrons from the N-type flow to the P-type material, the junction temperature will rise. Direct contact with the thermocouple circuit in the actual reference is unavailable, so the above connection method instead, the experiments show that the introduction of a third material (copper lugs and wire) does not change the characteristics of the circuit in the temperature difference circuit.
In this way, the semiconductor element can be a variety of connection methods to meet the requirements of users. Links to a P-type semiconductor and an N-type semiconductor into the thermocouple, connected to the DC power supply, temperature difference and heat transfer in the joints will be in the joints above, the current direction of N to P, the temperature dropped and endothermic, this is the cold side. In one of the following joints, the direction of the current P to N, the temperature rise and heat, so is the hot end.
Several pairs of semiconductor thermocouple according to the figure in the circuit in series, while in the heat transfer in parallel, which constitutes a common cooling thermopile. By icons connected to the DC power supply, this side of the heat continue to heat and maintain a certain temperature, the cold junction of the thermopile into the work environment to endothermic cooling is thermoelectric cooling works.
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